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National AI Research InstituteMaking a Better Tomorrow

Organization

Introduction of Research

Photonic/Wireless Devices Research Division

  • Optical Communication Components Research Group
    A variety of researches are in progress to establish technologies which are necessary to realize key optical devices for the next-generation high speed optical network with enormous capacity.

    As coherent optical communication technology based on phase modulation and polarization division multiplexing has been introduced to reach a high channel speed and capacity over 100Gb/s, we are developing various optical components for transceivers operating at data rate more than 400Gb/s. Utilizing the coherent optical transceiver technology, it is expected to reach a high-speed and bandwidth-adaptive transceiver and its components for next generation elastic optical communication networks.

    In addition, the optical ADD/DROP functionality is installed at the nodes in the ring network architecture. The intellectual optical switch is needed for high capacity, as the optical path in the link can be remotely controlled. ROADM optical switch with these functionalities is a key device in the optical ring network. In this research we have target of developing key components for flexible-grid CDC-ROADM to realize SDN and smart devices for utilizing optical switches in data centers.

    ※ ROADM: Reconfigurable Optical Add Drop Multiplexer
    ※ CDC: Colorless, Directionless, Contentionless
    ※ SDN: Software Defined Network

     Image <Optical Communication Components Research Group>
  • Photonic Convergence Components Research Group
    1. Study on Eye-safe Three-dimensional Laser Image
    Three-dimensional laser image technology is one of strategic research areas as a key fundamental technology which cannot be covered by conventional sensors in the cutting-edge commercial applications. such as robot vision and autonomous navigation vehicle.
    Most traditional approaches to detect three dimensional images in a very short distance are mainly based on a silicon photo-detector. It means that those cannot be efficient to detect the eye-safe wavelength (~1.5 μm), resulting several critical limitations to be adapted in specific applications. Since there have been some reports about the superior properties of eye-safe wavelength (~1.5 μm) in the safety issues in the car autonomous navigation applications, the eye-safe wavelength will be a key factor in the research area of the three-dimensional laser image technology.
    Since the traditional silicon-based photodetector cannot provide a efficient way to detect the eye-safe wavelength, skilled and proficient research backgrounds on the compound process and device are required to develop the high sensitivity photodetector to detect a light in a single-photon-level. Our research environments including researcher with various technological backgrounds and experiences on the compound semiconductor and optoelectronics, enables us to proceed this research area of three-dimensional image technology in a exceptionally efficient way.
    The developed high-sensitivity detector in this research area effects not only on the eye-safe three-dimensional laser image applications, but also quantum computing area. The quantum computer is able to be used in several applications including security, drug medicine development, new material development, physics/chemistry and so on. We are doing research on high sensitive detector and quantum computing circuit, and these primary skill in quantum computer enables to advance the quantum computing realization.

    2. Access Optical Components and high power Laser Technology
    We research III-V semiconductor lasers for mobile and access optical communications, high power lasers and their applications. Chip design, fabrication and packaging are main activities to generate new products for the applications in 5G mobile and access optical communications and new emerging manufacturing technologies. By solving technology Issues such as reliability and high power operation of the lasers we can deliver our technologies and relevant IP into small and medium companies. Our laser source research and developing activities will open up new products in the emerging fields of optical communications, semiconductor, display, automobile, sensor and computer industries.
    We also doing research on high stable ultrashort laser (Supercontinuum on frequency domain) techniques via optical comb generator with modulation skill. We have been doing several researches related to optical comb including ultra small optical comb chip based on pulse laser diode, supercontinuum via high nonlinear medium, microwave photonics based on optical comb. Ultrashort pulsed laser techniques with high stability will be used to overcome previous technique limitations in ultra-broad wire/wireless communication and imaging areas.

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  • RF/Power Components Research Group
    RF/Power Components Research Group has been the national leading center of semiconductor technology for the last 20 years, and it is now on the leading edge of compound semiconductor technologies. Recently, the research has been targeted especially on GaN based high power MMICs and power amplifier modules for the applications of mobile infrastructure radars, and the development of original core technologies for high-efficiency and energy-saving power semiconductor devices. RF/Power Components Research Group also provides fabrication supports to domestic and international R&D groups in compound semiconductor areas by developing new devices and MMICs and providing foundry services for commercial products to industry clients.

    All R&D activities are being conducted in a 3,600 sq. ft. clean-room laboratory dedicated solely for compound semiconductor device fabrication. The clean-room laboratory is fully loaded with many sophisticated equipment to process, monitor, and characterize wafers up to 4 inch. Laboratory equipment include i-line stepper, inductively coupled plasma (ICP) etcher, e-beam evaporator, and systems for 100 kV e-beam lithography, plasma-enhanced chemical vapor deposition (PECVD), and rapid thermal annealing, and so on. Separate RF measurement laboratory and package laboratory are also being actively utilized for various R&D activities.

    In order to vitalize high frequency RF components industry, RF/Power Components Research Group provides not only the development basis and commercialization schemes that can produce prototypes to meet the standards of the commercially viable products, but also provides fabrication services for multi wafer projects. This support is aimed to provoke country-wise research cooperation system between industry and academia and help small and medium-sized enterprises establish the thrust for market penetration. In addition, RF/Power Components Research Group is contributing as a hub for the industrial development by establishing relationships between product testing and certification organizations and mass production facilities, as well as small and medium-sized enterprises.

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